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Sixth APPMA Annual Scholarship now open

 

The Australian Packaging and Processing Machinery Association (APPMA), in conjunction with the Australian Institute of Packaging (AIP), has announced that submissions are now open for the sixth annual scholarship program which will enable a packaging engineer the opportunity to complete a Diploma in Packaging Technology to the value of over $9000.

The Diploma in Packaging Technology is an internationally recognised Level 5 foundation degree qualification that will prepare students to take responsibility for packaging operations at any level through the supply chain. The qualification is comprehensive, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.

According to Mark Dingley, chairman of the APPMA, the Annual Scholarship Program is a unique opportunity for a packaging engineer to attain a Diploma in Packaging Technology and further their education in the packaging industry.

“The APPMA has been offering this educational program now for six years and we have been very pleased with the calibre of winners, all of whom are busy completing their Diplomas as we speak,” Dingley said.

Former scholarship winner Jamie Schellebeck, who is now a packaging engineer at Amcor Fibre Packaging, comments: “Winning the scholarship in 2013 was a wonderful opportunity for me and I am eager to gain more technical expertise in the packaging industry by undertaking the Diploma in Packaging Technology. I look forward to graduating from the course in a few years.”

Ralph Moyle, AIP national president, added that the AIP is at the forefront of packaging training and education in Australasia, helping to shape the careers of generations of packaging professionals – from packaging technologists to international packaging business leaders along with a host of people in associated disciplines – sales and marketing, purchasing, production and environment.

“The Diploma in Packaging Technology is an internationally recognised degree that will provide exemplary skills to graduates and we commend the APPMA for their long-term commitment to educational growth within the packaging industry. We encourage all packaging engineers in Australia to apply,” he said.

Application forms are now available for the APPMA 2014 Scholarship program and can be accessed by emailing appma@appma.com.au or info@aipack.com.au or visiting either www.appma.com.au or www.aipack.com.au

Submissions must be received by close of business on  Friday, April 11 with the 2014 winner being announced as a part of Packaging & Processing Week which will be held alongside the AIP National Conference on June 17 and 18 at the Sofitel Hotel in Sydney.

 
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